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Multi-Tech Systems, Inc. MTQ-LAT3-B02-SP LTE Cat 1 Modem w/Fallback (AT&T)

The MultiConnect® Dragonfly™ (MTQ series) embedded cellular modems are fully certified and cellular carrier (MNO) approved, ready-to-integrate modules. This module is certified for AT&T and supports LTE Cat 1 with HSPA fallback.

Distribution Partners


The MultiConnect® Dragonfly™ embedded cellular modems are fully certified and MNO approved, ready-to-integrate modules that offer developers the functionality of a programmable computing platform with the convenience of an onboard cellular radio all in one compact design. From a software perspective, Dragonfly is compatible with Samsung’s ARTIK programming platform allowing for rapid prototyping, development and deployment. This connectivity option allows developers can host their application and have access to a full suite of interfaces for connecting sensors or other remote assets.

Dragonfly can be used as an embedded cellular SoM providing the maximum in design and application flexibility or it can be used as an embedded cellular modem requiring little or no modification to your existing design. This model supports AT&T LTE Category 1 offering 10 Mbps peak downlink and 5 Mbps peak upload with HSPA fallback.

This powerful suite of hardware and software products greatly reduces your time to market and makes your Internet of Things (IoT) device a reality today.

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  • End device certified by leading carriers
  • Family of cellular options include 4G-LTE, 3G HSPA+, 3G EV-DO and 2G 1xRTT
  • Developer friendly to integrate and quickly deploy assets
  • Long solution lifecycle reduces redesign time and cost

Tech Specs


LTE 3GPP Release 9 (Category 1; 10 Mbps peak downlink/5 Mbps peak uplink) with HSPA fallback

Frequency Band (MHz)

4G: 700(B12/ B13)/850(B5)/ AWS1700(B4)/1900(B2) 3G: 850(B5)/1900(B2)

TCP/IP Functions



2 UFL (Cellular, Rx Diversity/ MIMO) 1xMicro USB, 1x 40-Pin Board-to-Board, 1xMicro SIM

Host Processor

Cortex M4 (STM32F411RET) 512 Kbytes of Flash memory and 96 Kbytes of SRAM (B01)


1 x UART, 1 x HS USB, 1 x SPI, 1 x I2C, up to 6 analog inputs and up to 16 digital input/output (B01/B03) 1 x UART, 1 x HS USB (B02)


58.4mm x 34.9mm (2.3 x 1.375 inches)

Operating Temperature

-40° to +85° C

Storage Temperature

-40° to +85° C

Relative Humidity

20% to 90% RH, non-condensing

EMC Compliance

FCC Part 15 Class B

Radio Compliance

FCC Part 22, 24, 27


UL/cUL 60950-1 2nd ED, IEC 60950-1 2nd ED +Am.2




AT&T/T-Mobile/Aeris (Bell, Rogers, Telus planned)



  • Data sheet

    MultiConnect® Dragonfly™ Embedded Cellular SoM (System-on-Module)

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